For all the physical and digital equipment that electronics control, electrical systems are quite fragile by themselves. From the wires alone to a full circuit board system, electrical components are susceptible to damage from water, wind, heat, cold, pressure, dust, gasses, and many other stress factors. This vulnerability has presented many issues with long-term function of electronics since early electrical products were developed.
Because of this, manufacturers, engineers, and other players in the electronics industry are continually creating new ways of protecting and strengthening electrical components and assemblies. As a manufacturer of some of the toughest ruggedized electronics in the industry, RiverSide Electronics understands the importance of low pressure molding as a strengthening and protecting measure for our products.
Ruggedized electronics are designed to face harsh environments like outdoor conditions, high EMI surroundings, fume-filled industrial spaces, and more. To maintain function and reliability in the long-term, ruggedized electronics require specialized treatment in the production process. In addition to other protection methods, this treatment includes low pressure molding using Mold Man® high-quality equipment.
What is low pressure molding?
Low pressure molding uses a hot-melt material to seal or otherwise enclose an electronic component at a low temperature and pressure. For example, RiverSide uses high-performance polyolefins and polyimides melted at approximately 410º F to mold a component at 30 to 300 PSI. Because of the relatively low heat and pressure, this process molds around an electronic component without damaging the fragile electrical systems.
Where do we use it?
RiverSide uses low pressure molding primarily in the production of our ruggedized electronics. The molding process seals connection points, covers parts, and otherwise encapsulates components to protect the electrical system as a whole from particulates, liquids, vibrations, harsh light, and many other conditions that could otherwise damage electronics. Low pressure molding is also used in the production of other electronics we manufacture and assemble including printed circuit board assemblies and certain parts used in the system integration process.
Since its initial development in the 1970s, low pressure molding has been key in the manufacturing and assembly of a wide range of electronics. The process of low pressure molding replaced toxic and sometimes dangerous molding processes that were often expensive and environmentally detrimental. Today, low pressure molding offers a fast, cost-effective, and safe protection process for many electronic components.
To learn more about our uses of low pressure molding and our electronic assembly services, contact RiverSide Electronics at (507) 523-3220 or send us a message online today.