THERMAL INEQUALITIES-OVERCOMING TOMBSTONES AND OPENS

Tombstoning on small SMT chip packages is a common defect in electronic manufacturing.  Multiple contributing factors can cause this phenomenon including varying thermal mass between opposing pads. The reflow profile can have a direct impact on tombstone occurrences. Two common industry profile techniques are used to compare the effects on tombstones with end of line defect data. Visual verification is done by duplicating test profiles on a rework station. The results show a clear benefit of one profile technique over another to reduce tombstoning.

Learn more….

OVERCOMING TOMBSTONES DUE TO THERMAL INEQUALITIES

RiverSide Electronics participates in the Winona Area Chamber of Commerce MN Manufacturing and Technology Tours

We recently toured Winona Area Chamber members through our Lewiston facility.  Our goal was to show our diverse technology and expertise in electronics manufacturing.  After a brief introduction to our integrated services, we demonstrated surface mount and through hole placement processes.  It was exciting to demonstrate new equipment recently installed such as 3D automated optical inspection and our smart inventory storage system.  All participants were extremely impressed and we enjoyed the show and tell time!

 

Welcome to RiverSide Electronics’ New Site!

We’re excited to unveil our re-designed website! We wanted a website that not only looked great but was easier for you to use. We’ve expanded our content to provide you with more information, so you can get to know us better. Navigation on the website has also been simplified to make it easier for you to explore our site and see everything we offer!

We hope you’re as excited about our new website as we are! Go ahead and explore and get to know our professionals and learn what RiverSide Electronics can do for you.